A sputtering target is a material that is used to create thin films in a technique known as sputter deposition, or thin film deposition. The sputtering gas is often an inert gas such as argon.

During this process, the sputtering target material, which begins as a solid, is broken up by gaseous ions into tiny particles that form a spray and coat another material, which is known as the substrate. The shape of a sputtering target is usually either rectangular or circular.

Variety of materials including: Titanium (Ti), Tantalum (Ta), Tungsten (W), and Molybdenum (Mo). Metal targets are provided in various purity levels to suit your specific requirements, with the minimum purity of 99.9% up to 99.99%. Each sputtering target ships complete with a Certificate of Analysis .

Common Specification: Ø 80×40, Ø100×40, Ø180×50mm.